[2024]
high-performance thermal management components for electronics using nano-nonwovens based on high-strength, high-heat-resistant organic fibers
high-performance thermal management components for electronics using nano-nonwovens based on high-strength, high-heat-resistant organic fibers
Total performance period
-
General organization
코오롱인더스트리(주)구미공장
Task composition
1. Detailed task
manufacturing technology for heavy-weight nano-nonwovens based on high-strength, high-heat-resistant organic fibers with thermal decomposition temperatures above 450 °C
Main contents of technology development
Test analysis, evaluation and certification contents
Managing organization
코오롱인더스트리(주)구미공장
Participating organizations
2. Detailed task
high-performance thermal interface materials and components for electronic devices with through-thickness thermal conductivity around 20 W/m·K
Main contents of technology development
Test analysis, evaluation and certification contents
Managing organization
주식회사 제이비랩
Participating organizations